Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA.
Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an extensive look at the causes and types of voiding, key factors to consider when tackling voiding challenges, and how to design stencils or bottom termination component (BTC) pads to avoid voiding.
Bahou supports Indium Corporation's advanced SMT materials, fluxes, and engineered and thermal materials for customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Joe is based in Huntington Beach, California, and has more than 20 years of experience in electronics assembly manufacturing, including hands on experience in SMT production. He has worked for several major manufacturing companies and he has worked on the process development of 01005 chip component placement on to a printed circuit board. Bahou earned his bachelor's degree in mechanical engineering from the University of Massachusetts (Lowell). He is a Certified SMT Process Engineer and a Six Sigma Green Belt.
To view papers authored by Bahou and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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