Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA.
Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an extensive look at the causes and types of voiding, key factors to consider when tackling voiding challenges, and how to design stencils or bottom termination component (BTC) pads to avoid voiding.
Bahou supports Indium Corporation's advanced SMT materials, fluxes, and engineered and thermal materials for customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Joe is based in Huntington Beach, California, and has more than 20 years of experience in electronics assembly manufacturing, including hands on experience in SMT production. He has worked for several major manufacturing companies and he has worked on the process development of 01005 chip component placement on to a printed circuit board. Bahou earned his bachelor's degree in mechanical engineering from the University of Massachusetts (Lowell). He is a Certified SMT Process Engineer and a Six Sigma Green Belt.
To view papers authored by Bahou and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
