Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA.
Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an extensive look at the causes and types of voiding, key factors to consider when tackling voiding challenges, and how to design stencils or bottom termination component (BTC) pads to avoid voiding.
Bahou supports Indium Corporation's advanced SMT materials, fluxes, and engineered and thermal materials for customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Joe is based in Huntington Beach, California, and has more than 20 years of experience in electronics assembly manufacturing, including hands on experience in SMT production. He has worked for several major manufacturing companies and he has worked on the process development of 01005 chip component placement on to a printed circuit board. Bahou earned his bachelor's degree in mechanical engineering from the University of Massachusetts (Lowell). He is a Certified SMT Process Engineer and a Six Sigma Green Belt.
To view papers authored by Bahou and other Indium Corporation experts, visit www.indium.com/techlibrary.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
