Indium Corporation expert Joe Bahou, Technical Sales Support Engineer, will share his knowledge at the SMTA San Diego Technical Expo, November 5, San Diego, Calif., USA.
Voiding can cause field failures and thermal problems, and lead to customer dissatisfaction with their end product. In Avoiding the Pitfalls of Voiding in PCB Assemblies, Bahou helps attendees Avoid the Void® with an extensive look at the causes and types of voiding, key factors to consider when tackling voiding challenges, and how to design stencils or bottom termination component (BTC) pads to avoid voiding.
Bahou supports Indium Corporation's advanced SMT materials, fluxes, and engineered and thermal materials for customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Joe is based in Huntington Beach, California, and has more than 20 years of experience in electronics assembly manufacturing, including hands on experience in SMT production. He has worked for several major manufacturing companies and he has worked on the process development of 01005 chip component placement on to a printed circuit board. Bahou earned his bachelor's degree in mechanical engineering from the University of Massachusetts (Lowell). He is a Certified SMT Process Engineer and a Six Sigma Green Belt.
To view papers authored by Bahou and other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
