到目前为止，我已经概述了 Indium 的焊料强化产品系列 以及一些应用（QFN 失效、边缘连接器和射频屏蔽连接器）。现在，我将介绍另一种应用：为通孔焊点增加焊料量。
通孔焊点是通过波峰焊形成的，这是一种额外的制造工艺，会增加装配商的成本。用于形成焊点的焊膏可以扭转装配商的效率困境，但也有其自身的缺点。通常很难印制足够的焊膏来完全填满孔洞，确保最大的可靠性。在焊膏中加入 Indium 的焊料强化预型件可以帮助填补因单独使用焊膏而留下的空白。
要了解更多有关空化 和 Indium焊接强化预型件的信息，请访问我们的网站和YouTube 频道。
如需购买我们的焊料强化预型件样品，请访问buy.solder.com。
您也可以直接通过[email protected] 与我联系。
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