Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
Indalloy303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of traditional low-temperature solders.
As a low-temperature, Pb-free solution, Indalloy303 offers:
- A reflow temperature as low as 170
- 优异的热循环性能
- Resistance to hot tearing
- Compatibility with SAC in hybrid BGA joints
- Low voiding
Indalloy303s flux vehicle, Indium5.7LT-1, is an air-reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-containing low-temperature alloys. It delivers:
- Superior print transfer efficiency
- Clear post-reflow flux residue
- Solder bead and solder ball minimization
- Exceptional wetting on OSP, Immersion Ag, Immersion Sn, and ENIG
- Excellent coalescence of small deposits
- Outstanding SIR performance under challenging low-temperature reflow conditions
For more information about Indium Corporations high-reliability alloy products, visit www.indium.com/products/solders/solder-alloys/.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
