A typical LASER component before heat-sink mounting with a compressible Heat-Spring. Image Source: http://news.thomasnet.com/images/large/469/469336.jpg.
In addition to the thermal benefits of this material, the customer realized some mechanical benefits as well.
He said, "Handling the Heat-Spring™ material is 10-100 times easier from a fragility point of view [compared with previously evaluated materials], especially in the tight space of our configuration." The Heat-Spring™ can be handled as a small foil with tweezes or a suction tip and placed cleanly into location.
The Heat-Spring™ is then clamped down to make tight interfacial contact. The LASER customer noted, "Getting consistent results seemed much more straight forward when clamping the material down [compared with other thermal materials including regular indium foils]. I could actually feel the pieces compress as I tightened the screws."
For further information on using the Heat-Spring™ in applications similar to this LASER diode case study, please feel free to contact me.