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Driving e-Mobility: Rel-ion Technical Webinars

The Driving e-Mobility: Rel-ion™ Technical Webinars series will address a range of topics beneficial to anyone with technical involvement or interest in electric vehicles and the automotive industry.
InSIDER Series Rel-ion Technical Webinars
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This Driving e-Mobility: Rel-ion™ series of webinars is specifically for those in the automotive industry that might be making the transition to the electric assemblies or those that have been working within this area of the industry for the past several years.
Future topics from our technical experts will include: Building more Reliable Assemblies for Higher Mission Profiles, Design Considerations for Board Layout & Material Selection, and Manufacturing Best Practices.
InSIDER Series Rel-ion Technical Webinars

Archived Rel-ion Webinars

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Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics web logo
Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics

Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback.

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Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. The increased use of bottom-terminated components (BTC), high-density electronics, and high-reliability alloys needed for today’s automotive applications has resulted in a renewed focus on voiding reduction. Voiding in solder bumped components (e.g., BGAs and CSPs) and BTCs (including QFNs and DPAK) each have their own unique cause and mitigation techniques. To consistently maintain an acceptable level of voiding per industry standards and self-imposed levels due to stringent in-use requirements, a detailed understanding of the unique causes of voiding and process mitigation techniques is needed. This session will review the cause and effect relationship between voiding and the soldering materials used in today’s electronics assemblies. We will also review material and process solutions to maintain acceptable levels of voiding in various forms of SMT assembly.

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Increasing Requirements for Electrical Reliability in Automotive Applications web logo
Increasing Requirements for Electrical Reliability in Automotive Applications
Current material test conditions for no-clean solder pastes are no longer sufficient. In particular, the test parameters according to J-STD 004B do not reflect the new, longer mission profile of automotive electrification applications. The parameters for test voltage, test time, and test structure do not fit hybrid or full EV applications. In order to prevent vehicle breakdowns caused by EMC effects such as dendrite growth, new test conditions are already being introduced. These are primarily driven by OEM and standards consortia such as DKE (German) and IEC (international). More

Due to changes in the operating conditions of electronic assemblies, new mission profiles are constantly needed for lifetime reliability. These also increase the demands on the materials used in assemblies. In the area of “no-clean” solder pastes, the focus is on the Surface Insulation Resistance (SIR) test as proof of the electrochemical duration reliability of these flux residues. For example, today’s existing test duration has increased from 168 hours to 1,000 hours (+600%). Some flux systems in solder pastes already have solutions to these new challenges.

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