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Driving e-Mobility: Rel-ion Technical Webinars

The Driving e-Mobility: Rel-ion™ Technical Webinars series will address a range of topics beneficial to anyone with technical involvement or interest in electric vehicles and the automotive industry.
InSIDER Series Rel-ion Technical Webinars
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This Driving e-Mobility: Rel-ion™ series of webinars is specifically for those in the automotive industry that might be making the transition to the electric assemblies or those that have been working within this area of the industry for the past several years.
Future topics from our technical experts will include: Building more Reliable Assemblies for Higher Mission Profiles, Design Considerations for Board Layout & Material Selection, and Manufacturing Best Practices.
InSIDER Series Rel-ion Technical Webinars
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Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis web logo
Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis
October 12, 2022
SESSION #1 @ 8:30AM Germany/12PM India/2:30PM China, Malaysia SESSION #2 @ 10AM San Francisco / 1PM New York / 6PM London / 7PM Germany
Presenter: David Sbiroli, Principal Engineer, Global Accounts Technical Manager
This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. More

This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. In this seminar Sbiroli will discuss:

  • Printed circuit board assembly (PCBA) material’s selection & optimization (solder paste & board design)
  • Proper storage & handling techniques
  • Stencil selection
  • Stencil printer setup
  • Common solder paste printing defects & how to overcome
  • Designing a reflow profile for low voiding & high reliability
  • Understanding & mitigation of common reflow related defects including voiding, head-in-pillow (HiP), non-wet opens (NWO), graping & tombstoning

A question & answer session will be held at the end of the presentation. Please bring your SMT process challenges to discuss with the presenter. Sbiroli has almost 30 years’ experience related to SMT materials & process optimization.

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Archived Rel-ion Webinars

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Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection web logo
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection web logo
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection

In Design Considerations for Board Layout and Material SelectionSjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics.

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In Design Considerations for Board Layout and Material SelectionSjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics. However, the rapid growth of EVs and more sophisticated electronics on all types of automobiles shows that these high-density assemblies are not being fully adapted into the automotive market. Before starting any developmental work or implementing a new technology, it is critical to understand the products, their capabilities, and industry requirements. If these are not fully understood, failure is the most probable outcome.


This presentation will discuss conducting DfX based on end-product requirements and the need to perform proper root cause analyses before making any material or process changes.

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Driving e-Mobility: Rel-ion™: Increased Reliability for Higher Mission Profiles in Automotive Electronics web logo
Driving e-Mobility: Rel-ion™: Increased Reliability for Higher Mission Profiles in Automotive Electronics
Increased Reliability for Higher Mission Profiles in Automotive Electronics,Enhanced automotive electrification has resulted in increased mission profiles (more cycles, higher service temperatures) for PCB assemblies as well as power modules (for inverters)... More
Increased Reliability for Higher Mission Profiles in Automotive Electronics,Enhanced automotive electrification has resulted in increased mission profiles (more cycles, higher service temperatures) for PCB assemblies as well as power modules (for inverters). The solder joints experience greater thermo-mechanical loads and there will be instances where traditional SAC solder alloys may not be able to fulfill more stringent product lifetime validation requirements. Therefore, the choice of solder materials becomes more critical as they have to check multiple design requirements – (a) increased hardness to compensate for creep under stress with increased temperatures; (b) balancing hardness with the right amount of ductility so as to not transmit the stress elsewhere; (c) ensuring that the alternate solder alloy can be processed in the same window used for SAC solders. Less
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Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics web logo
Driving e-Mobility: Rel-ion™: Voiding Mechanisms & Solutions For High Density Automotive Electronics
Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. More
Since the early days of SMT assembly, one of the most persistent defects with the greatest longevity is voiding in solder joints. Other defects – such as graping, head-in-pillow, and non-wet opens – have known solutions, but voiding remains largely unsolved and with each technology inflection seems to make a strong comeback. The increased use of bottom-terminated components (BTC), high-density electronics, and high-reliability alloys needed for today’s automotive applications has resulted in a renewed focus on voiding reduction. Voiding in solder bumped components (e.g., BGAs and CSPs) and BTCs (including QFNs and DPAK) each have their own unique cause and mitigation techniques. To consistently maintain an acceptable level of voiding per industry standards and self-imposed levels due to stringent in-use requirements, a detailed understanding of the unique causes of voiding and process mitigation techniques is needed. This session will review the cause and effect relationship between voiding and the soldering materials used in today’s electronics assemblies. We will also review material and process solutions to maintain acceptable levels of voiding in various forms of SMT assembly. Less
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Increasing Requirements for Electrical Reliability in Automotive Applications web logo
Increasing Requirements for Electrical Reliability in Automotive Applications
Current material test conditions for no-clean solder pastes are no longer sufficient. In particular, the test parameters according to J-STD 004B do not reflect the new, longer mission profile of automotive electrification applications. The parameters for test voltage, test time, and test structure do not fit hybrid or full EV applications. In order to prevent vehicle breakdowns caused by EMC effects such as dendrite growth, new test conditions are already being introduced. These are primarily driven by OEM and standards consortia such as DKE (German) and IEC (international). More
Due to changes in the operating conditions of electronic assemblies, new mission profiles are constantly needed for lifetime reliability. These also increase the demands on the materials used in assemblies. In the area of “no-clean” solder pastes, the focus is on the Surface Insulation Resistance (SIR) test as proof of the electrochemical duration reliability of these flux residues. For example, today’s existing test duration has increased from 168 hours to 1,000 hours (+600%). Some flux systems in solder pastes already have solutions to these new challenges. Less

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