Driving e-Mobility: Rel-ion™: Best Practices For SMT Assembly & Root Cause Analysis
SESSION #1 @ 8:30AM Germany/12PM India/2:30PM China, Malaysia SESSION #2 @ 10AM San Francisco / 1PM New York / 6PM London / 7PM Germany Presenter: David Sbiroli, Principal Engineer, Global Accounts Technical Manager
This webinar will focus on optimizing two of the most important areas of the SMT assembly process, printing & reflow. To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and finetuned to work with the materials being used for assembly. In this seminar Sbiroli will discuss:
- Printed circuit board assembly (PCBA) material’s selection & optimization (solder paste & board design)
- Proper storage & handling techniques
- Stencil selection
- Stencil printer setup
- Common solder paste printing defects & how to overcome
- Designing a reflow profile for low voiding & high reliability
- Understanding & mitigation of common reflow related defects including voiding, head-in-pillow (HiP), non-wet opens (NWO), graping & tombstoning
A question & answer session will be held at the end of the presentation. Please bring your SMT process challenges to discuss with the presenter. Sbiroli has almost 30 years’ experience related to SMT materials & process optimization.Less
Archived Rel-ion Webinars
Driving e-Mobility: Rel-ion™: Design Considerations for Board Layout & Material Selection
In Design Considerations for Board Layout and Material Selection, Sjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics.More
In Design Considerations for Board Layout and Material Selection, Sjoberg and Marques will discuss how implementing high-density SMTA assemblies in electronic products require many considerations. Previously, high-density SMTA assemblies were primarily used in mobile phones and consumer electronics. However, the rapid growth of EVs and more sophisticated electronics on all types of automobiles shows that these high-density assemblies are not being fully adapted into the automotive market. Before starting any developmental work or implementing a new technology, it is critical to understand the products, their capabilities, and industry requirements. If these are not fully understood, failure is the most probable outcome.
This presentation will discuss conducting DfX based on end-product requirements and the need to perform proper root cause analyses before making any material or process changes.