Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Flux Technical Documents
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Safety Data Sheets
Package-on-Package Blog Posts
Indium Corporation's new colored fluxes for PoP flux inspection and assembly.
Often times people assume that the dipping process is easy… it is once you have taken the time up-front to optimize the process. The optimization can take a bit of time and trial and error.
I have recieved a number of inquiries over the years regarding Pack-on-Package (PoP) Manufacturing Processes. One of the most frequent questions that I have recieved is whether to use a PoP Flux or a PoP Solder Paste.
From One Engineer to Another®
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