Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications, including automotive/electric vehicle, LED, optical, and military. Indium Corporation was one of the first soldering materials supplier to earn the International Automotive Quality Recognition 16949:2016 certificates for five of its global solder manufacturing facilities and its company headquarters.
Patent-pending Durafuse LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
듀라퓨즈 LT:
- 열에 민감한 부품 및 플렉스 폴리머를 위한 솔루션 제공
- 프로세서 구성 요소 및 다층 보드의 열 휨 방지
- 특히 RF 차폐 부착, 포스트 언더필 공정 및 재작업 애플리케이션에서 스텝 납땜에 대한 저온 요구 사항을 충족합니다.
Indium8.9HF Solder Paste is an industry-proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process for high-reliability automotive electronics.
Indium8.9HF:
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Ensures low-voiding on bottom termination components (e.g. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- Excellent response-to-pause, even after being left on the stencil for 60 hours
- Enhanced printing and reflow performance after remaining at room temperature for one month
- Consistent printing performance for up to 12 months when refrigerated
- Offers excellent pin-in-paste and through-hole solderability
- 표면이 산화되는 것을 방지하기 위해 조기 플럭스 확산을 방지합니다.
- Performs with both Pb and Pb-free alloys.
Indium Corporation is also featuring InFORMS, solder preforms that do more than just bond two surfacesthey are designed to address specific challenges of the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information on Indium Corporations proven products for high-reliability applications, visit www.indium.com or visit Indium Corporations booth. Show attendees can also attend the presentation of Leo Hu, senior area technical manager East China, High-Reliability Solder Material Impact and Application on Automotive Electronic Assemblies, to learn more about some of Indium Corporations materials in action.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.
