Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications, including automotive/electric vehicle, LED, optical, and military. Indium Corporation was one of the first soldering materials supplier to earn the International Automotive Quality Recognition 16949:2016 certificates for five of its global solder manufacturing facilities and its company headquarters.
Patent-pending Durafuse LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Durafuse LT：
- 為熱敏元件和柔性聚合物提供解決方案
- 防止處理器元件和多層板的熱彎曲
- 符合階梯式焊接的低溫要求，特別是在 RF 屏蔽連接、後填充製程和返修應用中
Indium8.9HF 錫膏是經業界驗證的錫膏，提供免清洗、無鹵素的解決方案，設計用於生產低揮發、增強電氣可靠性，以及改善高可靠性汽車電子產品印刷製程中的穩定性。
Indium8.9HF：
- 透過增強表面絕緣電阻 (SIR)，抑制電流洩漏和樹枝狀生長，提高電氣可靠性
- Ensures low-voiding on bottom termination components (e.g. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在鋼板上放置 60 小時，仍有極佳的暫停反應
- 在室溫下放置一個月後，印刷和回流焊性能增強
- 冷藏時可保持長達 12 個月的穩定列印效能
- 提供優異的引腳貼合與通孔焊接性
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金。
Indium Corporation is also featuring InFORMS, solder preforms that do more than just bond two surfacesthey are designed to address specific challenges of the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information on Indium Corporations proven products for high-reliability applications, visit www.indium.com or visit Indium Corporations booth. Show attendees can also attend the presentation of Leo Hu, senior area technical manager East China, High-Reliability Solder Material Impact and Application on Automotive Electronic Assemblies, to learn more about some of Indium Corporations materials in action.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
