Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications, including automotive/electric vehicle, LED, optical, and military. Indium Corporation was one of the first soldering materials supplier to earn the International Automotive Quality Recognition 16949:2016 certificates for five of its global solder manufacturing facilities and its company headquarters.
Patent-pending Durafuse LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Durafuse LT:
- 为热敏元件和柔性聚合物提供解决方案
- 防止处理器组件和多层电路板发生热翘曲
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment, post underfill processes, and rework applications
Indium8.9HF 焊膏是一种经过行业验证的焊膏，可提供免清洗、无卤素的解决方案，旨在产生低空洞、提高电气可靠性，并改善高可靠性汽车电子产品印刷过程中的稳定性。
铟8.9HF：
- 增强的表面绝缘电阻 (SIR) 可抑制电流泄漏和树枝状生长，从而提高电气可靠性
- Ensures low-voiding on bottom termination components (e.g. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在网板上放置 60 个小时后，暂停响应也非常好
- 在室温下放置一个月后，印刷和回流焊性能得到增强
- 冷藏后可保持长达 12 个月的稳定印刷性能
- 具有极佳的引脚锡膏和通孔焊接性
- 防止助焊剂过早扩散，防止表面氧化
- 适用于铅合金和无铅合金。
Indium Corporation is also featuring InFORMS, solder preforms that do more than just bond two surfacesthey are designed to address specific challenges of the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information on Indium Corporations proven products for high-reliability applications, visit www.indium.com or visit Indium Corporations booth. Show attendees can also attend the presentation of Leo Hu, senior area technical manager East China, High-Reliability Solder Material Impact and Application on Automotive Electronic Assemblies, to learn more about some of Indium Corporations materials in action.
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至Jingya Huang。您还可以通过www.linkedin.com/company/indium-corporation/或@IndiumCorp 关注我们的专家，From One Engineer To Another (#FOETA) 。
