Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications, including automotive/electric vehicle, LED, optical, and military. Indium Corporation was one of the first soldering materials supplier to earn the International Automotive Quality Recognition 16949:2016 certificates for five of its global solder manufacturing facilities and its company headquarters.
Patent-pending Durafuse LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Durafuse LT:
- 为热敏元器件 柔性聚合物提供解决方案
- 防止处理器元器件 多层电路板因热膨胀而变形
- 满足阶梯焊接的低温 ，特别适用于射频屏蔽件的安装、底部填充材料 后的处理以及返修 应用
Indium8.9HF Solder Paste is an industry-proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process for high-reliability automotive electronics.
铟8.9HF：
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Ensures low-voiding on bottom termination components (e.g. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- Excellent response-to-pause, even after being left on the stencil for 60 hours
- 在室温下放置一个月后，印刷和回流焊性能得到增强
- Consistent printing performance for up to 12 months when refrigerated
- Offers excellent pin-in-paste and through-hole solderability
- 防止助焊剂过早扩散，防止表面氧化
- Performs with both Pb and Pb-free alloys.
Indium Corporation is also featuring InFORMS, solder preforms that do more than just bond two surfacesthey are designed to address specific challenges of the power electronics industry. InFORMS are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information on Indium Corporations proven products for high-reliability applications, visit indiumstg.wpenginepowered.com or visit Indium Corporations booth. Show attendees can also attend the presentation of Leo Hu, senior area technical manager East China, High-Reliability Solder Material Impact and Application on Automotive Electronic Assemblies, to learn more about some of Indium Corporations materials in action.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
