The m2TIM™ is a patent-pending solid/liquid hybrid thermal interface material that combines liquid metal with a solid metal preform to provide reliable thermal conductivity while eliminating the need for a solderable surface.
InGa and InGaSn alloys are liquid at room temperature. Using one of these alloys alone would provide superior thermal conductivity, but would also require containment of the liquid. Introducing a solid solder preform into the process gives you a material that absorbs the liquid and provides the necessary containment without compromising the thermal conductivity. This hybrid approach offers excellent surface wetting and low interfacial resistance, as well as eliminating the risk of pump-out of the liquid alloy.
Metal thermal interface materials (TIMs) are known to have higher isotropic thermal conductivity than any non-metals. Metals conduct heat and electricity with their valence electrons. This very effective conduction mechanism is a property of liquid as well as solid metals and alloys. In addition to the high thermal conductivity of all metals, those in the liquid form will also exhibit low interfacial resistance, ensuring that they can dissipate heat quickly. Liquid metals are used in both TIM1 and TIM2 applications.
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