铟泰公司 热界面材料，用于辅助集成电路（IC）的老化测试过程。该过程是一种加速应力测试，旨在筛除不良元件。请参阅此文，深入了解IC加速应力测试（老化测试）的必要性。如图表所示，元件在使用首年存在高比例的早期故障率，加速循环测试正是为了筛除不良IC，避免其污染本应正常的批次产品。
加速循环包括电压和温度的升高。升高的温度通过集成电路顶部的加热器元件施加，加热器使用热界面材料将热量均匀有效地传入集成电路。热界面需要具有低电阻、高导热性和足够的顺应性，以弥合芯片顶部和烧入加热器底部之间的（不太完美的）间隙。
这种应用的首选热界面是铟，我们可以帮助您确定哪种铟基热界面最适合您的预烧应用。
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