大家好
My team came across an interesting article the other day from IEEE Spectrum that talked about the recent advent of Mini-LEDs. A lot of thought has been put into Mini-LEDs and LEDs in general at Indium Corporation already, check out Product Development Specialist Claire Hotvedt’s recent thoughts on our new Durafuse LT solder and its applications in LED light bulbs. There’s more to LEDs than light bulbs though, they’re getting smaller and smaller, which is where my team’s products come into play.
微型 LED（不要与 microLED 混淆，两者之间的区别完全是另一个话题！）正越来越多地用于显示器中，这是因为使用成百上千个小型 LED 作为背光源与 LCD 显示面板结合使用，可以提供极高的对比度、深黑色和高动态范围。在玩兼容 HDR 的 PC 游戏时，你就能真正体会到它的好处，许多新游戏都兼容 HDR，包括最新的《使命召唤》和《刺客信条》游戏。
文章详细介绍了 Mini-LED 相对于当前基准有机发光二极管（即 OLED，虽然也是 LED，但使用有机材料作为导电材料，而不是半导体）的优势。OLED 比 Mini-LED 技术具有更高的对比度，因为 OLED 直接发出光线，而不经过 LCD。不过，Mini-LED 在亮度方面略胜一筹，价格也便宜得多，Mini-LED 显示器比 OLED 显示器便宜 500 到 1000 美元。
So where does Indium Corporation fit into all of this? Our suite of semiconductor and advanced assembly materials are ideal for Mini-LED assembly. Many Mini-LEDs need to be packed together, and the soldering pads of these Mini-LEDs need to be very small accordingly, in the range of less than 200 microns. Indium Corporation’s SiPaste solder paste materials feature excellent printability and are compatible with the fine powder sizes necessary for Mini-LED assembly, in order to fit through the stencil during stencil printing onto these small pads. Our SiPaste solder pastes are also available in both water-soluble and no-clean varieties, with our benign residue no-cleans being especially good for Mini-LED assembly due to the difficulty in cleaning the PCB post-reflow at these small pad sizes and tight pitches.
Indium Corporation’s advanced assembly fluxes are also a great fit for Mini-LED assembly! Our LED Tacflux 007 is the leading die-attach flux for the LED industry; it’s a high activity flux that’s easily cleanable with standard solvents, and it’s also able to withstand high temperatures, particularly important with soldering to gold-tin alloys, which is common for LED dies. Our ULR residue flip-chip fluxes also fit this assembly well, with our fluxes solving common issues in mini-LED assembly such as die shift (with such small pad pitch any die movement is dangerous), and electrical open issues (with strong wetting power).
The adoption of Mini-LED technology is coming quickly, and Indium Corporation is more than equipped to light the way for LED manufacturing.
