通常情况下，只要调整回流曲线，就能解决诸如飞溅、空洞、坍塌/桥接和墓碑等焊接缺陷。因此，了解回流曲线的不同阶段及其对最终焊点的影响非常重要。
回流焊过程的最开始，也就是烤箱的最初几个区域，主要是烘干焊膏中的溶剂，为助焊剂中的活化剂开始去除氧化物做好准备。关键是要缓慢而有控制地升温；如果锡膏加热过快，助焊剂就会沸腾，并开始在电路板上溅满焊料。升温过快可能导致的另一个缺陷是焊膏坍塌，这会导致桥接。在所有溶剂蒸发之前过多地加热焊膏会导致粘度下降，从而导致焊料坍塌。建议的升温速率为 0.75°C/s 至 2°C/s。
随后的博文将讨论回流曲线的其他方面。
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