Why Don't You Present Your Findings Too?
I just submitted my proposal for the a title="amanda whittemore indium corporation presenting on indium soldering for thermal properties at......
I just submitted my proposal for the a title="amanda whittemore indium corporation presenting on indium soldering for thermal properties at......
Unacceptable voiding under a die With less voiding under a power die, more heat can be dissipated through the solder into......
First flat section (just below the solder, looking up through the copper traces) img src="http://www.indium.com/_images/0507/chip_a...
Folks, We are all aware that the miniaturization of electronics continues unabated. As consumers we benefit from this phenomenon, as electronic assemb...
Ok, so it happened again. Another urgent request was brought to me for action. This time it was a customer who had performed a Red Dye Penetration......
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
Have you ever had to hand-place solder washer preforms on the pins of a connector and found it to be very labor intensive? Indium Corporation has a pr...
When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also impor...
We are looking into a way to deposit solder on a typical die attach machine without using die-attach paste – and without a tooling change. This...
The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or c...
A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins wit...