CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.
이 회사는 다음과 같은 제품을 선보일 예정입니다:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. Its low-organic content composition affords short drying times for increased throughput and less volume reduction between wet and post-sintered deposits, reducing the paste amount required.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
To learn more about Indium Corporation’s comprehensive portfolio of power electronics packaging and assembly solutions, visit indium.com or meet our company experts at PCIM Asia, hall 16, booth F30.
인디엄 코퍼레이션 소개
인듐코퍼레이션®(Indium Corporation®) 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 소재 정제, 제련, 제조 및 공급 서비스를 제공하는 선도적인 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 멕시코, 싱가포르, 한국, 영국 및 미국에 공장을 운영하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 https://www.indium.com/을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다. 또한 www.linkedin.com/company/indium-corporation/에서 당사의 전문가 그룹인 ‘From One Engineer ToAnother® (#FOETA)’를 팔로우하실 수 있습니다.
