CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.
该公司将展出以下产品：
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.
- InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. Its low-organic content composition affords short drying times for increased throughput and less volume reduction between wet and post-sintered deposits, reducing the paste amount required.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- InBAKE™29是一种铜基烧结 焊膏，专为功率分立器件芯片-attach应用 和应用 设计，适用于需要高热导率 、高电导率以及高工作/运行温度的应用。该产品专为无压批量炉烧结工艺设计。
To learn more about Indium Corporation’s comprehensive portfolio of power electronics packaging and assembly solutions, visit indium.com or meet our company experts at PCIM Asia, hall 16, booth F30.
关于铟泰铟泰公司
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解有关“铟泰公司 ”的更多信息，请访问https://www.indium.com/或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
