BiAgX® is a high-melting, lead-free (Pb-free) solder paste technology that serves as a DROP-IN replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.

Features & Benefits

BiAgX®: A Drop-In Replacement for High-Pb Solders

Environmental and legislative concerns are driving consumers away from products that contain lead, including solders used in die-attach applications for analog semiconductor assembly.

BiAgX® is the ONLY low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.


  • Drop-in replacement for high Pb-containing solder pastes, requiring minimal process optimization and no new capital expenditure
  • Both Pb-free and Sb-free, conforming to applicable standards
  • Available in both dispense and printing forms, like standard die-attach solder paste
  • Reflows, solders, and solidifies like other solder paste
  • Fluxes are cleanable with standard cleaning chemistry and processes
  • Requires minimal adjustments when converting from a standard high-Pb solder paste-based process
  • Suited to smaller die and lower voltage applications, such as those used in QFN packages for portable electronics, automotive, and industrial applications
  • Contains no costly specialty materials, such as nanoparticles or gold
  • Requires no pressure on the die during the reflow process
  • Designed to work in high-temperature environments at temperatures in excess of 150°C with no degradation of the mechanical structure or other properties

This patent-pending technology is evolving into a family of products, all based around a platform technology.

Options for Metallic Die-Attach Materials
Options for Metallic Die-Attach Materials
BiAgX® Reflow Mechanism
BiAgX® Reflow Mechanism

Die-Attach Materials

Indium Corporation also offers other die-attach solder materials, and is currently the only materials supplier in the Automotive Electronics Council (AEC).

  • Solder Pastes - dispense and print
  • Solder Preforms
  • Solder Ribbon and Foil
  • Die-Attach Wire
    • Indium-based solders
    • Gold-tin solders
BiAgX® Ideal Reflow Profile
BiAgX® Chart
BiAgX® Solderability
BiAgX® Chart
BiAgX® Voiding
BiAgX® Chart
X-ray Image of 2 mm x 2 mm Die on DBC Substrate
Taken from "Lead-free Solder Attach for 200°C Applications" - Johnson et al., iMAPS HiTen Conference, Oxford UK, July 2013
Best Practice Profile Guidance
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Parameter Range Unit
Initial ramp to 140°C 1.2 - 1.8 °C/s
Ramp 140 - 262°C 2.4 - 3.0 °C/s
Time above 262°C 25 - 35 seconds (s)
Peak temperature 320 - 330 °C
Initial cooling rate 8 - 10 °C/s

High Temperature Effects on BiAgX®

BiAgX® Effect of High Temperature Storage t(0)
Cross-section: before test
BiAgX® Effect of High Temperature 200°C/3000 hrs
Cross-section: after test

Taken from "Reliability Assessment of BiAgX® Die-Attachment for SiC Power Modules" Tanimoto S. et al, JSAP [Japanese Journal of Applied Physics], April 2013

BiAgX® and High-Pb Joint Strength: Effects of Time and Temperature
Cross-section: after test

Reliability Tests

  • 3x additional reflows at peak temperature of 260°C
  • Thermal cycle at -55°C to 125°C 2000 cycles
  • Thermal shock at -55°C to 150°C 2000 cycles