BiAgX®
BiAgX® is a high-melting, lead-free (Pb-free) solder paste technology that serves as a DROP-IN replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.
Features & Benefits
BiAgX®: A Drop-In Replacement for High-Pb Solders
Environmental and legislative concerns are driving consumers away from products that contain lead, including solders used in die-attach applications for analog semiconductor assembly.
BiAgX® is the ONLY low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.
Features
- Drop-in replacement for high Pb-containing solder pastes, requiring minimal process optimization and no new capital expenditure
- Both Pb-free and Sb-free, conforming to applicable standards
- Available in both dispense and printing forms, like standard die-attach solder paste
- Reflows, solders, and solidifies like other solder paste
- Fluxes are cleanable with standard cleaning chemistry and processes
- Requires minimal adjustments when converting from a standard high-Pb solder paste-based process
- Suited to smaller die and lower voltage applications, such as those used in QFN packages for portable electronics, automotive, and industrial applications
- Contains no costly specialty materials, such as nanoparticles or gold
- Requires no pressure on the die during the reflow process
- Designed to work in high-temperature environments at temperatures in excess of 150°C with no degradation of the mechanical structure or other properties
This patent-pending technology is evolving into a family of products, all based around a platform technology.
Die-Attach Materials
Indium Corporation also offers other die-attach solder materials, and is currently the only materials supplier in the Automotive Electronics Council (AEC).
- Solder Pastes - dispense and print
- Solder Preforms
- Solder Ribbon and Foil
- Die-Attach Wire
- Indium-based solders
- Gold-tin solders
BiAgX® Ideal Reflow Profile
BiAgX® Solderability
BiAgX® Voiding
Taken from "Lead-free Solder Attach for 200°C Applications" - Johnson et al., iMAPS HiTen Conference, Oxford UK, July 2013
Best Practice Profile Guidance
| Parameter | Range | Unit |
|---|---|---|
| Initial ramp to 140°C | 1.2 - 1.8 | °C/s |
| Ramp 140 - 262°C | 2.4 - 3.0 | °C/s |
| Time above 262°C | 25 - 35 | seconds (s) |
| Peak temperature | 320 - 330 | °C |
| Initial cooling rate | 8 - 10 | °C/s |
Cleanability of BiAgX®
Both Kyzen and Zestron products were tested with BiAgX®. The technical reports on the results of these tests can be downloaded below:
- Kyzen Technical Report for Indium7.16 BiAgX® HT Pb-Free Printing Solder Paste
- Kyzen Technical Report for Indium7.08 BiAgX® HT Pb-Free Dispensing Solder Paste
- Kyzen Cleaning Characterization Report for Indium7.08 BiAgX® HT Pb-Free Dispensing Solder Paste
- Kyzen Cleaning Characterization Report for Indium7.16 BiAgX® HT Pb-Free Printing Solder Paste
- Zestron Technical Report for Indium708-26-3 BiAgX® Technology
- Zestron Technical Report for Indium716-102-3 BiAgX® Technology
High Temperature Effects on BiAgX®
BiAgX® Effect of High Temperature Storage t(0)
BiAgX® Effect of High Temperature 200°C/3000 hrs
Taken from "Reliability Assessment of BiAgX® Die-Attachment for SiC Power Modules" Tanimoto S. et al, JSAP [Japanese Journal of Applied Physics], April 2013
BiAgX® and High-Pb Joint Strength: Effects of Time and Temperature
Reliability Tests
- 3x additional reflows at peak temperature of 260°C
- Thermal cycle at -55°C to 125°C 2000 cycles
- Thermal shock at -55°C to 150°C 2000 cycles