應用
Indium Corporation 的產品範圍廣泛，應用於各行各業。我們的尖端解決方案以高效能和高可靠性著稱，是汽車電子組裝、高溫焊接、電力電子封裝和組裝以及熱管理等領域的理想選擇。
探索我們產品的常見應用
看看我們的創新材料如何應用於各行各業。
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2.5D 與 3D 包裝
Techniques to incorporate multiple dies in a…
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球形附件
Including both water-wash and no-clean ball-attach fluxes
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凸點融合
Achieve robust solder bumps on wafers with…
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催化
Indium and gallium compounds for catalysis, chemical…
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陰極保護
Indium metal for sacrificial anodes and corrosion…
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化學合成
Indium and gallium compounds for chemical synthesis…
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夾子和導線架固定
應用夾具與引線框架固定於…
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連接器與纜線組件
Solder tubes and washers for precision in…
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模組接頭
晶片黏著解決方案涵蓋焊膏至金基底...
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電鍍
Try indium electroplating to enhance appearance and…
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倒轉式晶片
A crucial technique in advanced semiconductor packaging.
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高可靠性
適用於各種高可靠性 PCBA 應用的各種選項。
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高溫焊接
Offering high-temperature soldering materials for critical applications…
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熱棒焊接
Solder pastes, flux, and more for reliable…
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浸入式冷卻
A technique on the rise for thermal…
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低溫液態與易熔合金
Low temperature liquid & fusible alloys for…
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低溫焊接
Transform your operations with our low-temp soldering…
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MEMs 組件
Micro-Electro-Mechanical Systems (MEMS).
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封裝-附加
Wide selections to address the challenges in…
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包裝對包裝
Crafted with optimal viscosity, flux technology, and…
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PCB 組裝
Proven and cutting-edge materials for PCB assembly…
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功率電子封裝與組裝
廣泛系列的經實證高可靠性焊料與……
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甲酸回流焊接
Flux-free solder pastes and materials for formic…
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返工
Our rework solutions include solder wire, TACflux,…
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機器人焊接
Quality flux-cored wire enhances robotic soldering performance.
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密封：低溫與氣密
Low temperature liquid & fusible alloys for…
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選擇性焊接
A rising cost-effective and reliable method for…
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半導體封裝與組裝
關鍵半導體封裝確保功能性與耐用性。
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半導體測試
Semiconductor test solutions with soft metal alloys…
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系統級封裝與異質整合組裝技術
系統級封裝 (SiP) 與異質整合解決方案
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基板/墊片-連接
Premier substrate-attach solutions in the power module…
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熱蒸發與 PVD 鍍膜
Achieve efficient and high-quality thin film deposition.
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散熱管理
Thermal solutions for HPC ensuring reliability and…
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TIM1、TIM1.5、TIM2
Metal-based TIMs deliver high thermal performance and…
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波峰焊接
Wave soldering is a pivotal soldering technique…
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使用最新的材料、技術和專業應用支援來優化製程。一切從與我們的團隊聯繫開始。