When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface, whether you are choosing materials that will expand and contract at the same rate or bonding alloys or processes that will handle the stress of deformation caused by these changes. This topic has been explored by hundreds of people, but I like this video because the presenter is both thorough and fun:
相關文章
Robotic Soldering Fundamentals Part 1: From Automation to Materials That Make It Reliable
Robotic soldering has evolved from a productivity upgrade into a precision requirement—especially as electronics become smaller, denser, and require shorter production cycles. In Part 1 of this
Rethinking Your Alloy Strategy: How to Win with Low-Silver Solder
Silver prices are escalating rapidly, consistently trending upward. If you manage a bill of materials (BOM) for electronics manufacturing, you understand precisely how this volatility impacts your
Mastering Assembly Consistency with InFORMS® Solder Preforms
Manufacturing modern electronics often feels like a balancing act—literally. Assembly tilt and uneven coplanarity are persistent headaches that compromise solder joints, leading to weak connections