Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at IMPACT-IAAC 2019, Oct. 23-25, Taipei, Taiwan.
Dr. Lee will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the development of fluxes for flip-chip and SiP assembly. These high-viscosity, high-tack fluxes are designed to be used to secure components at the placement and reflow stage allowing the flux residue to be cleaned.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has more than three decades in the development of fluxes, alloys and solder pastes for SMT industries and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
To view additional papers authored by Indium Corporation’s experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
