圖書館
部落格
主題
類型
年份
作者
產品類型
Always Take Care of the Team
One of the biggest things that I stressed about myself when I was first applying for this internship was that I am a team player. When I say this, I mean that I’m willing to do whatever it
Tax Extensions and Payment
Over the past week, my work within the finance department at Indium Corporation has spanned a variety of tasks necessary to our organization. One of the most interesting and unique discussions was
First Project and Lunch-n-Learn
Hello Everyone, My second week at Indium Corporation is now complete and I continue to feel as if I am doing more learning than working! Everything I have been doing is extremely interesting, and I
Herkimer County BOCES Career Day (and more)
Last Friday, Jim McCoy and I took a drive down to BOCES in Herkimer, NY for their career fair. I kept thinking that we were the most advanced company at the event, but the truth is, Indium
Marcom 實習生的一天
The second most important thing in my life is to find a job that I am excited to wake up for every day. It’s a close runner up to the most important thing in my life, which is definitely
Switching to a Sustainable Method of Record Keeping is Vital for a Company’s Success
One of the biggest priorities of many companies today is maintaining a productive yet sustainable workplace. From what I have observed so far, Indium Corporation is already doing its part in this
Newfound Networking Skills
The first week of my internship at Indium Corporation has already provided me with new and profound networking abilities. I learned a lot during my first lunch-n-learn meeting of the summer. Indium
Basketball: More Than Just A Sport
Ever since 4th grade, I’ve been obsessed with the game of basketball. It has been very rewarding to me through many aspects of my life. I have been blessed with enduring friendships from my
How My High School Music Program Prepared Me for an Internship.
We all know that one kid who quit band after high school because it wasn’t “cool.” Well, here’s a message to the “cool kids” who quit band; you missed out on a lot
The Conversation Stack
Every Wednesday, the 10 Indium Corporation summer college interns participate in a lunch-n-learn session, held at Indium Corporation's global headquarters. Going in, my expectations were low. I
Solder Redefined Part 4 – Baseplate to Heat-Sink
Seth Homer: At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve a more reliable IGBT that can
Blog Post Week One
Today marks one full week of working at Indium Corporation. I have learned more than enough information to be able to publish an insightful post about what I have done so far. During my time here I
Derek Wenndt: Technical Support Laboratory Intern
Hello all! My name is Derek Wenndt and I am the Technical Support Laboratory Intern for the next 9 weeks. I have already completed one week of work, and it has been a great
重新定義焊接第 3 部分 - DBC 基板至底板
Seth Homer:正如我們所討論的,在 IGBT 堆疊中有三個附加層級的峰值關注。在 Indium Corporation,我們正在重新定義我們如何在裸片連接、基板和晶片上使用焊料。
JJ Besse: R&D Metallurgy Intern
PCB (printed circuit board), CTE (coefficient of thermal expansion), THC (through-hole component) these are just a taste of the countless new acronyms I've learned over the first few days, and,
7 Tips to Gain Social Media Popularity
We all want social media fame, don't we? Okay, maybe being a social media icon isn't at the top of everyone's list of
Bryan; The Semiconductor Assembly Materials Intern
Greetings, My name is Bryan Stokes-Cawley and I am the 2017 Indium Corporation Semiconductor Assembly Materials College Intern. I am extremely honored and excited to have this great opportunity to
重新定義焊接第 2 部分 - 模具接合
Seth Homer:正如這四個系列影片中的第一個影片所討論的,在 IGBT 堆疊中有三個附加層級的峰值問題。透過重新定義我們在晶片連接處使用焊錫的方式,DBC Substrate、
Breaking the Ice
Hello Readers, I have recently completed my first week as a college intern at Indium Corporation and am very pleased with my experience so far. However, before I explain any further I would like to
不確定您需要什麼?
讓我們幫助您。
在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。


