Indium Corporation has released a new high-reliability alloy with enhanced thermal cycling performance specially formulated for harsh environments.
Indalloy®292 is an innovative alloy engineered to provide advanced lifetime reliability to industries requiring high-performance and to address the increased temperatures in many automotive applications. Indalloy®292 offers:
- Superior performance in harsh thermal cycling conditions from -40 to 150°C
- Excellent chip resistor thermal cycling performance with zero failures for over 3,000 cycles
- Excellent ball grid array (BGA) thermal cycling performance with characteristic lifetimes 2X that of other leading high-reliability solders
- Enhanced thermal cycling reliability on Cu OSP, ImSn, and other standard PCB surface finishes
- Lifetime high shear strength
- Low solder joint cracking
Indalloy®292 also offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process for high-reliability automotive electronics.
For more information about Indium Corporation’s high-reliability alloy products, visit www.indium.com/solder-alloys.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer To Another® (#FOETA)。
