Indium9.91 is a no-clean solder paste designed for use in package-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and package retention.
Indium9.91:
- Eliminates defects due to package warping
- Provides excellent solderability
- Has a long pot life
- Provides consistent solder paste volumes
Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
