Indium Corporation, Utica’s Technology Company®, has named Brook Sandy-Smith, Technical Support Engineer for PCB Assembly, the winner of the 2017 Silver Quill Award.
Indium Corporation’s Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance to, and impact on, the industry.
Sandy-Smith’s technical article, Overcoming Assembly Challenges with BTCs, Technical Support Engineer for PCB Assembly Materials, details the updated recommendations for design and implementation of bottom-termination components (BTCs), including major changes made to industry standard IPC-7093. This paper was first presented at the Electronic Design Innovation Conference and Exhibition 2017, was recognized as an Outstanding Paper Award Finalist, and published in Microwave Journal.
Brook Sandy-Smith is a Technical Support Engineer based at Indium Corporation’s Global Headquarters in Clinton, NY and a leader in the industry for technical knowledge and support. Specializing in PCB assembly materials, she works closely with customers to develop custom solutions to optimize their processes. Sandy-Smith is an SMTA Certified Process Engineer and has a passion for developing and implementing standardized test methods. She is an active member of several IPC committees, SMTA programs, and iNEMI projects, and is currently serving as chair of the J-004 committee and Vice President of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
