Indium Corporation’s Sze Pei Lim, Regional Product Manager, will host an InSIDER Series webinar on soldering material technology for heterogeneous integration on Webex at 8:30 a.m. Singapore Time on Nov. 12 (7:30 p.m. Eastern Time, Nov. 11; 12:30 a.m. British Time, Nov. 12).
The development of heterogeneous integration, which packs more dies or components into smaller footprints than in previous assemblies, requires the integration of multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials. During Soldering Material Evolution for Heterogeneous Integration, Lim will outline trends in various soldering material technologies for heterogeneous integration, including solder paste, flip-chip, and ball-attach fluxes.
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at https://www.indium.com/webinar.
Lim manages the semiconductor product lines for the Asia region and works closely with the internal sales and research and development (R&D) teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move toward heterogeneous integration.
Some of her recent work includes the development of materials and processes for advanced packaging for fine-feature printing for SiP application, as well as for one-step OSP ball-attach applications. Lim has more than 25 years of experience, specifically in the areas of PCB assembly and surface mount technology. She joined Indium Corporation in 2007 as a Technical Manager in Southeast Asia. Prior to that, she was a Research and Development Chemist, focusing on solder paste and flux formulation. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer, has earned her Six Sigma Green Belt designation, and is heavily involved in many research and road mapping organizations.
To register for Lim’s webinar, visit indiumstg.wpenginepowered.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to ensure Indium Corporation’s security measures don’t filter messages into spam folders. This is a first-come, first-served event.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
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