Indium Corporation’s David Sbiroli, R&D Senior Technologist, will participate in a Global SMT & Packaging debate on advanced print and paste deposition techniques on Tuesday, Oct. 6 at 7:45 am Pacific Time, 10:45 am Eastern Time, 3:45 pm British Time, 4:45 pm Central European Time.
Achieving the perfect solder paste volume in the print process can have a direct impact on solder joint reliability. In this Global SMT & Packaging webinar, participants will discuss the do’s and don’ts of printer setup, stencil design, and paste deposition to increase solder joint reliability in the assembly process.
The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://bit.ly/3c4vzDu.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at indiumstg.wpenginepowered.com/webinar.
In his role as R&D Senior Technologist, Sbiroli characterizes soldering materials’ critical performance attributes and assists in the development of new materials and accelerated test methods to augment performance needs. To fulfill this, he utilizes more than 25 years of hands-on experience in the selection and applications of PCBA materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of customers’ SMT and electronic assembly production lines. Sbiroli joined Indium Corporation in 1993 and previously held the position of Technical Manager of Global Accounts, where he was responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key multinational accounts. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam, and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
