Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Materials, will participate in a Global SMT & Packaging voiding panel on Tuesday, Sept. 8 at 10:45 a.m. Eastern Time (3:45 p.m. British Time/10:45 p.m. Malaysia Time).
Voiding under bottom termination components (BTCs) is a major industry challenge. As BTCs generate considerable amounts of heat during operation, it’s important to ensure voids do not form during reflow soldering, as they could potentially cause end-product overheating and field failures. During this panel, Is the Void Avoidable?, experts will examine the many approaches available to limit and mitigate the effects of voiding. The panel will be followed by a live Q&A session.
For more information or to register for the debate, visit https://bit.ly/3fzSbvV.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Nash is the Senior Product Manager for Indium Corporation’s PCB Assembly Materials. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. He also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. Nash joined Indium Corporation in 2005. He has authored several process and technical guidelines and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the IPC standards development committee. Nash has a bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and is a Certified SMT Process Engineer.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer To Another® (#FOETA)。
