Indium Corporation’s Joseph Hertline, Product Manager – ESM/Power Electronics, will present on materials solutions for high-reliability power electronics assembly during CHARGED Electric Vehicles (EVs) virtual conference, Sept. 1-3.
As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packing and assembly processes. During The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions, Hertline will analyze the major challenges within substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions that can help achieve high power density and promote better heat dissipation, resulting in highly-reliable power devices.
Hertline is the Product Manager for engineered solder materials focusing on power electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. He also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. He earned a bachelor's degree in mechanical engineering and an MBA from Clarkson University in Potsdam, NY.
CHARGED EVs virtual conference includes live webinar sessions and interactive Q&As, as well as new on-demand webinars and whitepaper downloads available in the weeks leading up to the event. Conference topics will span the entire EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC, and more.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
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