Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany.
At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.
As the Regional Technical Manager for Germany, Austria, and Switzerland, Karch provides support to Indium Corporation’s customers in those regions, including sharing process knowledge and making product recommendations. He has more than 20 years of automotive industry experience, including the advanced development of customized electronics. Karch is an ECQA-certified integrated design engineer, has a Six Sigma Yellow Belt, and was selected by the Austrian Patent Office as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly.
For more information about our experts’ recent work, visit indiumstg.wpenginepowered.com/techlibrary or visit our booth at the show.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
