Indium Corporations Strategic Advisor Dr. Dongkai Shangguan will share his technical insight and expertise on advanced packaging at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
As advanced packaging continues to drive towards heterogeneous integration, new materials need to be developed to address the many challenges faced in the assembly process. In his presentation, Innovative Materials for Advanced Packaging and System in Package (SiP), he will examine innovative materials for advanced packaging and SiP, particularly for small form factor modules, including solder paste for ultrafine-pitch printing, solders with various temperatures for hierarchical soldering, novel flux formulations for flip-chip attach that are compatible with underfill and molding compound, adhesive agents for fluxless soldering, high-reliability solders, and thermal management materials for SiP.
Dr. Shangguan is a strategic advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industrys most prestigious awards, including IPCs Presidents Award, the Society of Manufacturing Engineers (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelors degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books and more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 28 U.S. patents and several foreign patents.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About iMAPS SiP
IMAPS has established the Advanced System-in-Package Conference & Exhibition to focus exclusively on innovative SiP technology developments, solutions, and business trends. Advanced SiP 2022 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2022 will offer cutting-edge presentations from scientists, technologists, and business leaders across the globe in cellular, IoT, automotive, computing, and networking market segments.
