Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.
Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276. The paper presents a novel method of achieving bondline control through the use of InFORMS®, a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the SMTA, and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from the State University of New York at Binghamton.
To speak with Vijay in person, come visit our stand at PCIM #7-528 or email [email protected]. You can also visit our technical library at indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
