Indium Corporation’s Dave Sbiroli, Technical Support Manager, will share his industry insight at the SMTA Upper Midwest Expo & Tech Forum, June 27, Minneapolis, Minnesota, USA.
Sbiroli will present Impact of Storage Conditions on the Integrity of a No-Clean Solder Paste. As solder paste is being engineered to endure longer storage periods, it is important to keep this material in the best possible condition before and during use. Sbiroli will discuss the results of a study designed to determine a superior storage process and eliminate potential flux separation by examining four storage conditions and two package orientations over the course of a year for certain variables.
Sbiroli is responsible for the coordination, business maintenance, and deployment of technical services and resources to Indium Corporation’s multinational and regional accounts in Midwest USA. He joined Indium Corporation in 1993 and has over 25 years of experience in the electronics industry. He achieved one of the highest scores on the SMTA Process Engineer certification exam, and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. Sbiroli actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards. He earned his bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology.
To view papers authored by Sbiroli and other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
