Three Indium Corporation experts will share their expertise at the SMTA China East Technology Conference 2018 on April 23-26 in Shanghai, China.
Research Chemist Fengying (Alice) Zhou will present Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly, This presentation will detail various flux solutions that address the challenge of non-wet opens that result from the continuing trend toward miniaturization.
Evan Yin, Assistant Manager – Simulation Lab in Suzhou, China, will present Differences Between SMD and NSMD in the SMT Process. This presentation includes the distinctions between the two kinds of PCB pad designs, solder mask define (SMD) pad and non-solder mask define pad (NSMD).
Research Chemist Mary Ma will present Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175°C, which reviews the testing results of a novel lead-free solder alloy under harsh conditions.
Zhou joined Indium Corporation in 2010 and is based in Suzhou, China. She is responsible for developing SMT assembly solder materials. Additionally, she provides support to the global R&D team. Zhou earned her bachelor’s degree in applied chemistry and her master’s degree in inorganic chemistry from Suzhou University.
Yin joined Indium Corporation in 2017. He is responsible for equipment engineering at Indium Corporation’s Suzhou Process Simulation Lab. He provides technical support and services, such as product and process recommendations, troubleshooting, conducting product evaluations and qualifications. Before joining Indium Corporation, Yin worked in the surface mount technology field for more than 15 years. He has a degree in computer information management from Soochow University.
Ma joined Indium Corporation in 2010 and is based in Suzhou, China. She is responsible for developing halogen-free, lead-free, and no-clean flux chemistries with low voiding. Ma earned her bachelor’s degree in Chemistry from Qufu Normal University and her master’s degree in Physical Chemistry from Nanjing University.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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