Indium Corporation’s experts met with several industry media outlets during IPC APEX Expo 2020 from Feb. 1-6 in San Diego, Calif., USA.
As part of Indium Corporation’s ongoing mission to provide real solutions to the industry’s current and emerging challenges, experts from the sales, marketing, and technical support fields shared their perspective on the company’s role in emerging technologies, support of young professionals, and new products.
Chris Bastecki, Director of Sales and Global PCBA Marketing:
- Participated in an interview with EMS Now to discuss Indium Corporation’s emerging solutions that address customer challenges, especially in high-reliability and low-temperature applications.
Dr. Richard McDonough, Global Application Engineer/Semiconductor Product Specialist:
- Discussed Indium Corporation’s new silver sintering paste product offering with Global SMT & Packaging News. QuickSinter® delivers consistent, high-speed sintering on a variety of surfaces and die metallizations and works well in both high- and low-temperature pressureless applications.
Chris Nash, Product Manager, PCBA Assembly Solder Paste:
- Spoke with RealTime with IPC APEX regarding the company’s high-reliability solder products for 5G electrical reliability and ICT performance. Nash also reviewed Indium Corporation’s presence in other markets, including the automotive industry.
- Discussed the company’s 85-year history with EDACafé. He also talked about Indium Corporation’s new low-temperature alloy, Durafuse™ LT, as well as its new PicoShot™, and QuickSinter® products.
- Participated in What’s New in Electronics’ 5G technologies roundtable. He provided insight on what 5G will mean for the industry, including the increasing needs of automotive electronics and Indium Corporation’s approach to materials solutions for 5G.
- Debated the challenges, applications, and trade-offs of low-temperature solders during a Global SMT & Packaging moderated panel. Nash discussed how Indium Corporation’s new high-reliability low-temperature alloy technology Durafuse™ LT offers improved drop shock performance compared to other brittle low-temperature alloys, among other benefits.
Kay Parker, Technical Support Engineer:
- Met with RealTime with IPC APEX to discuss her career as a young professional, including how she used her internship with Indium Corporation as a way to further her education, gain clarity through real-world experience, and ultimately, get a job with the company.
Tim Twining, Vice President of Marketing:
- Provided Indium Corporation’s outlook on industry trends and developments with What’s New in Electronics TV.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
