Two Indium Corporation experts will present during PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.
Seth Homer, Product Manager Engineered Solders, will present The Impact of Solder Alloy Integrity in Power Electronics, which discusses the impact of solder on power electronics designs amid challenges for improved reliability and performance. Some of the criteria to be discussed include alloy homogeneity, purity, and the impact of dimensional tolerances.
Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present Automotive Electrification: Solder Matrix Reinforcement Solution for Increased Reliability.The paper examines the positive effect of enhanced thermal cycling reliability in IGBT power modules for substrate-to-baseplate attach, by incorporating a composite matrix in the solder preform. The matrix provides constant bondline control and reinforces the strength of the interconnect by enhancing creep resistance. These attributes are highly valuable to power module platforms in EVs and HEVs that operate at high voltages of 300+ Volts with increased thermal cycling reliability requirements.
Homer has worked with Indium Corporation for more than 20 years, serving in both manufacturing operations and marketing roles. He has been responsible for many of the products within the engineered solders product offering and is currently working with the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with manufacturing internally to help support current production demand and future product development.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.
At the show, Indium Corporation will feature the high-reliability products reviewed in Homer and Vijay’s presentations, as well as other high-performance thermal interface materials to improve first yields. For more information about Indium Corporation’s experts’ recent work, visit www.indium.com/techlibrary or look for them at the show in hall 6, stand 108 as well as their E-Mobility stand in Hall 6.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
