Two Indium Corporation experts will present at SMT Hybrid Packaging on Tuesday, June 5, in Nuremberg, Germany.
Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present Automotive-Grade Solder Paste for Enhanced Electrical Reliability & Low Voiding. The paper examines flux technology breakthroughs and test methods to eliminate dendritic growth for low-standoff components, as well as how to achieve a robust SMT process without compromising the electrical reliability of the no-clean flux.
Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present
Modern Solder Pastes to Solve Miniaturization Challenges (Processing of 01005 and Smaller) in German. The presentation examines the development of optimized flux chemistry in solder paste to overcome manufacturing challenges brought by miniaturization and maximize the process window to achieve high yields.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, which are comprised of solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
For more information about our experts’ recent work, visit indiumstg.wpenginepowered.com/techlibrary or visit us at the event at booth #4-301.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
