Four Indium Corporation experts will share their industry knowledge and expertise during a live virtual exposition at SMTA International from Sept. 28-30.
The following technical papers from Indium Corporation experts will be featured:
- Versatile TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- An Alternative Lead-Free, Low-Temperature Solder with Excellent Drop Shock Resistance by Dr. HongWen Zhang, R&D Manager, Alloy Group
- Fine Powder Investigation for Optimum Imperial 008004 Solder Paste Printing: Part I by Adam Murling, Assistant Engineering Manager—Technical Support
- Process Optimization for Reducing Solder Paste Splatter During Reflow by Leon Rao, Senior Technical Support Engineer
Dr. Lee will also host the professional development course, Achieving High Reliablity for Lead-Free Solder Joints – Materials Consideration.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA—the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities. Attendees who register for the Technical Conference will have exclusive access to over 100 technical presentations on-demand from Sept. 28-Oct. 23, as well as the ability to download all papers in the conference proceedings. Register for the free expo-only experience or the full technical conference package at https://smta.org/mpage/smtai-reg.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
