Indium Corporation will feature its new SACm™ Soldering Alloy at Nepcon South China August 27-29 in Shenzhen, China.
SACm™ is a high-reliability, low-cost soldering alloy that offers drop test performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC soldering alloys.
SACm™ satisfies the electronics assembly market’s demand for a soldering alloy that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.
SACm™ 的問世，在抗跌落測試表現上優於 SAC305 和 SAC105，同時還具備與 SAC305 相當的熱循環可靠性。這為製造商提供了一種價格實惠且高可靠性的 SAC 合金。這項發展對於通常需頻繁操作的消費性電子產品（例如行動裝置）的製造而言，尤具意義。
SACm™ 摻有錳，且銀含量低於其他無鉛合金。錳能提升強度，而較低的銀含量則能提供更穩定的成本結構，這對於成本敏感型應用尤為有利。
Additionally, Indium Corporation will feature its Indium8.9 Solder Paste Series, and Solder Fortification® Preforms.
The Indium8.9 series of solder pastes are Pb-free, halogen-free, and designed to eliminate graping, head-in-pillow, and QFN voiding defects. These solder pastes are designed with a robust processing window that minimizes potential defects and accommodates various board sizes and throughput requirements. Indium8.9 provides superior performance characteristics that increase customers’ cost savings, and provides finished goods reliability.
Solder Fortification® Preforms eliminate costly and/or time-consuming processes, such as wave and selective soldering. In addition, they are conveniently packaged in tape & reel for use in existing pick & place equipment. Preforms come in standard shapes, such as squares, rectangles, washers, and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.
Indium Corporation will be exhibiting at booth B-1E66.
如需進一步了解 Indium Corporation 的 SACm™ 焊膏，請造訪indiumstg.wpenginepowered.com/SACm或發送電子郵件至[email protected]。
