Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan.
Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings.
Flip-Chip Flux NC-26-A is generally used in mobile flip-chip packages; Flip-Chip Flux NC-26S is designed for larger fine pitch die (≤60micron); and Flip-Chip Flux NC-699 delivers the lowest residue of any flux in use in flip-chip production.
Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes provide enhanced activity control that avoids the two main soldering issues: solder bridging and cold joints. This flux technology also retains bump height after reflow, reduces the UBM/bump crack damage in the cleaning process, and boasts a high compatibility with capillary and molded underfills (CUF and MUF).
For more information on ultra-low and near-zero residue no-clean Flip-Chip Fluxes, visit indiumstg.wpenginepowered.com/no-clean-flip-chip-fluxes or stop at Indium Corporation’s booth, #3012.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
