Indium Corporation will continue to celebrate its 85th anniversary by featuring some of its industry-leading and newest alloys at Productronica, November 12-15, in Munich, Germany.
Since its founding, Indium Corporation has continued to research and develop new solutions for common industry issues of the day, while anticipating the industry’s future needs and challenges. Originating with an exploration into the benefits and interesting properties of indium metal, Indium Corporation has continually explored and advanced the materials science behind alloy and solder materials development.
The company’s 200+ available alloys include two new, innovative solutions:
- DurafuseTM LT, a low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. DurafuseTM LT offers improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- Indalloy®292, an alloy engineered to provide advanced reliability for high-performance applications, offers excellent thermal cycling performance at -40–150°C conditions, high shear strength, and low solder joint cracking. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF.
To learn more about Indium Corporation’s innovations in materials science, visit the company at Productronica, Hall A4, Booth 214.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
