Indium Corporation will introduce Indium10.5HF, a new halogen-free, Pb-free solder paste at the IPC APEX Expo Feb. 24-26 in San Diego, Calif.
Indium10.5HF is a no-clean solder paste designed to improve ICT first-pass yields. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry.
Indium10.5HF solder paste has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields. Indium10.5HF offers unprecedented stencil print transfer efficiency, making this solder paste suitable in the broadest range of processes. It also provides excellent head-in-pillow performance. Indium10.5HF solder paste saves time and increases output for companies that require ICT as part of their normal production.
"This solder paste is ideal for customers in a wide range of markets, including automotive, medical, computing, communications, and aerospace/military," Glen Thomas, product manager, PCB solder paste said. "Additionally, many of our customers have reported improved wetting and solderability for their applications, especially for RF shield-attach."
For more information about Indium10.5HF or Indium Corporation's complete Pb-free Solder Paste series, visit us at APEX in booth #1027, online at indiumstg.wpenginepowered.com/APEX-2015, or email [email protected].
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
