Indium Corporation is pleased to announce that Brian Rundell has joined the company as a Technical Support Engineer based at the companys headquarters in Clinton, New York.
Rundell is responsible for providing technical assistance to current and potential customers to resolve soldering process-related issues. This includes assisting with the optimization of Indium Corporations soldering materials in addition to providing product and process training.
Rundell brings more than 19 years of industry experience to Indium Corporation. Prior to joining the company, he spent ten years leading the manufacturing process development, qualification, and production support of circuit board assemblies for space and military applications. Some of his major accomplishments include directing efforts from prototype assembly through flight production on modules for the Navys Air and Missile Defense Radar system and Eutelsat Quantum communications satellite. He earned his bachelors degree in electrical engineering from Syracuse University and is a Six Sigma Green Belt.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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