Indium Corporation earned BISinfotech’s BETA Award for Global Innovative Solder Paste Solutions Provider of the Year on Friday, October 30 during a virtual ceremony.
The first award of its kind for the publication, the BETA awards aims to laud India’s entire ecosystem of product-driven innovation, think-tanks, CEOs, and successful entrepreneurs whose solutions have brought new milestones to the electronics market.
“We are honored to receive this recognition in the India electronics market,” said Tim Twining, Vice President of Marketing. “We are excited to be a part of India’s strong, promising future in the electronics supply chain.”
Indium Corporation continues to innovate in delivering a suite of leading-edge solder materials designed to empower the 5G lifetyle, including 5G infrastructure, automotive, mobile, and more. This drive for developing the solutions of current and emerging needs comes from the company’s belief that materials science changes the world. Since its founding, Indium Corporation has been driven by its curiosity to look at materials from a different perspective—transforming the ordinary into the unexpected.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer To Another® (#FOETA)。
