Indium Corporation has released a new solder research kit designed for soldering to gold plating using indium-based alloys.
Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors.
The more commonly used tin-based solder alloys rapidly scavenge or dissolve the gold during the reflow process, leading to the destruction of gold conduction patterns. Tin-based alloys also result in crack-inducing platelets within the solidified solder joint. Indium-based alloys, especially those in the indium-lead (InPb) family, cause appreciably less gold scavenging damage than tin-lead (SnPb) solders.
The Soldering to Gold Research Kit allows you to choose three different alloys from seven that are offered for the kit. The alloys come in the form of 0.76mm (0.030”) solid-core wire and represent melting temperatures ranging from 143-310°C. The kit also offers two compatible fluxes – TACFlux® 007 and TACFlux® 012.
Order your research kit at www.buy.solder.com. If you want more information on how to solder to gold, visit indiumstg.wpenginepowered.com/soldering-to-gold. For assistance on selecting the best alloys for your application, visit Indium Corporation’s Solder Alloy Selector Guide at indiumstg.wpenginepowered.com/solder-alloy-guide or contact our technical support team at [email protected].
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
