Indium Corporation’s Ed Briggs, Technical Support Engineer, Southeast USA and Eastern Canada, will participate in the Solder Joint Failure Analysis session at the Surface Mount Technology Association’s Space Coast Expo and Tech Forum June 13 in Melbourne, Florida.
The Solder Joint Failure Analysis session will explore analysis methods that will help attendees determine the root causes of solder joint failures in the circuit board assembly manufacturing process.
Briggs is an SMTA-certified process engineer. He earned his associate’s degree in chemical technology from Mohawk Valley Community College, where he received the Douglas J. Bauer Award for Excellence in Chemistry. He earned his Six Sigma Green Belt from Dartmouth College. Briggs joined Indium Corporation in 1992 and has held a variety of positions in production and technical support.
The SMTA Space Coast chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA local chapters plan events serving regional networks of industry professionals. For more information on upcoming expos, visit www.smta.org/expos.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
