Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Wisdom's presentation, Epoxy Flux – A Low-Cost, High-Reliability Approach to PoP Assembly, describes how epoxy fluxes combine soldering and reinforcement into one single process for increased mechanical, thermal, and electrical reliability with reduced assembly costs.
Fengying will deliver two presentations. Her first presentation, Corrosion Resistance of High-Temperature, Lead-Free BiAgX® Solder Paste, reviews the results of a comparison between BiAgX®, a drop-in, lead-free solder paste solution for high-temperature die-attach applications, and Pb5/Sn2.5/Ag and SAC305. She will share the morphological observations indicating that BiAgX® is more resistant to corrosion than the other two solder alloys.
Fengying's second presentation, The Effect of Thermal Pad Patterning on QFN Voiding, will explain how and why voiding at the QFN assembly can be suppressed by improving venting accessibility on the thermal pads with the use of a solder mask dividing strip.
SMTA China South is a conference that is held in conjunction with NEPCON South China 2014. This conference addresses the industry's most pressing issues in electronics assembly, advanced packaging, and lead-free electronics assembly, including practical skills development and emerging technologies. For information, visit www.nepconsouthchina.com.
Wisdom is an SMTA-Certified Process Engineer with more than nine years of experience in surface mount technology. Indium Corporation recognized her knowledge and expertise in 2007 with the prestigious Silver Quill Award for Best Technical Paper/Presentation of the year. She holds a degree in mathematics from Hubei Radio and Television University in China.
Fengying has been a research chemist for the Research and Development department since 2010. She is responsible for the development of SMT assembly materials, with emphasis on developing additives to enhance the thermal reliability of lead-free solder pastes. She holds a bachelor's degree in applied chemistry and a master's degree in inorganic chemistry from Suzhou University.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
